Vision chip

#	Item
11	DDf Innova Direct Die Feeder Wafer Feeding The DDf Innova perfects die feeding. Single wafers, are vertically loaded into the feeder, positioned automatically, then precisely located by a vision system. Add to Reading List Source URL: www.assembleon.com Language: English - Date: 2013-01-10 03:02:59 Flip chip Technology Microelectromechanical systems Wafer Semiconductor device fabrication Materials science Electromagnetism
12	MEMBERSHIP PROSPECTUS The MULTOS Consortium is an open membership body dedicated to the development and promotion of - MULTOS; the high security multi-application chip platform. The vision and goals of the Consortium are Add to Reading List Source URL: www.multos.com Language: English - Date: 2013-07-09 06:38:20 System software Consortium X Window System Software Smart cards MULTOS
13	PDF Document Add to Reading List Source URL: sl-div-bi-pb.web.cern.ch Language: English - Date: 2002-01-31 04:36:28 Electronic design Electromagnetism Integrated circuits Optoelectronics Vision chip Active pixel sensor Charge-coupled device Motion detection Electronic design automation Image sensors Electronics Electronic engineering